• Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee
  • Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee
  • Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee
  • Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee
  • Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee
  • Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee

Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee

Type: Surface Grinding Machine
Processing Object: Metal&Nonmetal
Abrasives: Grinding Disc
Controlling Mode: Normal
Automatic Grade: Semiautomatic
Precision: High Precision
Customization:
Gold Member Since 2018

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Manufacturer/Factory & Trading Company

Basic Info.

Model NO.
KJ200W
Certification
ISO 9001, SGS
Condition
New
Max. Grinding Diameter
200mm
Diamond Grinding Wheel Size
200mm
Revolving Speed
0-800 Rpm
Power
0.75kw
Weight
1100kg
After-Sales Service Provided
Engineers Available to Service Machinery Overseas
Workpiece Accuracy Control(Parallelism)
0.001mm
Transport Package
Standard Export Packing
Specification
1350*600*1600mm
Trademark
Kizi
Origin
China

Product Description

Description

   This unit is designed and produced for zirconia ceramics and sapphire LED substrate ect superhard product.

Products Show
 

HIGH SPEED PRECISION THINNING MACHINE
Usage: This unit is designed and produced for zirconia ceramics and sapphire LED substrate ect superhard product.

Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee
Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee

Features:
 1.CNC program control system, ensure the machine stability, security.
 2.High speed shaft system with high precision, ensure the machining precision when high-speed, high strength grinding. 
 3.One touch type vacuum cup system, improve the convenience of the clamping. 
 4.Intelligent constant torque explosion-proof function. 
 5.Constant temperature cooling system. 
 6.Automatic compensation system. 
 7.Optional online thickness measurement device. 
 8.Optional automatic grinding wheel dresser. 

 

Detailed Configuration
1.one touch type vacuum cup system
2.
high speed shaft system with high precision
Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee



Our Service

1. Factory with competative price,high quality and stability 
2. R&D Dep. with 20 technicians, 5 of them in decades experience 
3. Free charge of customer sample making 
4. Completed After sales service and expertise support from Taiwan


Our Company

Workshop & Lab

Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee

Company Activity

Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee

Patent

Sapphire Glass Wafer LED Substrate High-Speed Thinning Machine Lee


Packing & Delivery

Packing Details  : Packing, 1 pcs/carton
Delivery Details : Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity



FAQ

Q: Are you trading company or manufacturer ?
A: We are manufacturer.


Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ? is it free or extra ?
A:No, we could not offer the machine sample for free charge but can provide free proofing for the customer.



 

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Gold Member Since 2018

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Number of Employees
47
Year of Establishment
2010-01-12