This machine is designed for fast thinning of super hard materials such as zirconia ceramics and sapphire LED.
Products Show
High Precision Thinning and Lapping Machine for Silicon Wafers
Usage: This unit is designed and produced for zirconia ceramics and sapphire LED substrate ect superhard product.
Notes: As the technology is constantly updated, the above data is for reference only.
Features
1.CNC program control system, ensure the machine stability, security.
2.High speed shaft system with high precision, ensure the machining precision when high-speed, high strength grinding.
3.One touch type vacuum cup system, improve the convenience of the clamping.
4.Intelligent constant torque explosion-proof function.
5.Constant temperature cooling system.
6.Automatic compensation system.
7.Optional online thickness measurement device.
8.Optional automatic grinding wheel dresser.
Our Service
1. Factory with competative price,high quality and stability
2. R&D Dep. with 20 technicians, 5 of them in decades experience
3. Free charge of customer sample making
4. Completed After sales service and expertise support from Taiwan
Patents
Packing&Delivery
Packing Details : Packing, 1 pcs/carton
Delivery Details : Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer.
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
A:No, we could not offer the machine sample for free charge but can provide free proofing for the customer.
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