Silicon Wafer Grinding/Lapping Machine

Product Details
Customization: Available
Type: Surface Grinding Machine
Processing Object: Metal&Nonmetal
Gold Member Since 2018

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Number of Employees
47
Year of Establishment
2010-01-12
  • Silicon Wafer Grinding/Lapping Machine
  • Silicon Wafer Grinding/Lapping Machine
  • Silicon Wafer Grinding/Lapping Machine
  • Silicon Wafer Grinding/Lapping Machine
  • Silicon Wafer Grinding/Lapping Machine
  • Silicon Wafer Grinding/Lapping Machine
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Basic Info.

Model NO.
KS25B
Abrasives
Grinding Disc
Controlling Mode
Normal
Automatic Grade
Semiautomatic
Precision
High Precision
Certification
ISO 9001
Condition
New
Max. Grinding Diameter
202mm
Model Number
Ks25b
Voltage
380V
Power
6.5kw
Weight
1750kg
After-Sales Service Provided
Engineers Available to Service Machinery Overseas
Transport Package
Standard Export Packing
Specification
1680*1160*2350mm
Trademark
Kizi
Origin
China

Product Description

Description

   KIZI provides the most efficient and reliable solutions for flat lapping and polishing of components utilized in medical,mechanical seals, ceramic,automotive optical,photonic,MEMS,wafer and compound semi-conductor applications and other industrial markets.

Products Show

Series B double-sided lapping and polishing machine
Usage: This series machine is design  and produced for double sided lapping and polishing all kinds of seals, alumina, zirconia ceramic, glass, metal components, semiconductor components ect metal, non-metal product.


Silicon Wafer Grinding/Lapping Machine
Silicon Wafer Grinding/Lapping Machine




Features:

  1.Man-machine interface program control system, ensure the machine stability, security
  2.Segmentationprecision pressure control, suitable for coarse, medium and fine grinding and polishing process
  3.Using high precision shaft system, to ensure the precision of machine tools and durability
  4.Unique safety lock merchanism, to prevent accidental expired, power failure and disk fall hurt accident
  5.Outer ring gear and water retaining plate of semi-automatic ifting system, convenient to leave work pieces
  6.The machine running using the independent motor, make the upper and lower plate and the center of the gear peed to achieve the optimal proportion, cruise ships to achieve positive & negative, meet the repair disk process requirement


Our Service

1. Factory with competative price,high quality and stability 
2. R&D Dep. with 20 technicians, 5 of them in decades experience 
3. Free charge of customer sample making 
4. Completed After sales service and expertise support from Taiwan


Our Company

Workshop & Lab

Silicon Wafer Grinding/Lapping Machine

Company Activity

Silicon Wafer Grinding/Lapping Machine

Patent

Silicon Wafer Grinding/Lapping Machine



Packing & Delivery

Packing Details  : Packing, 1 pcs/carton
Delivery Details : Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity



FAQ

Q: Are you trading company or manufacturer ?
A: We are manufacturer.


Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.


Q: Do you provide samples ? is it free or extra ?
A:No, we could not offer the machine sample for free charge but can provide free proofing for the customer.



 

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