This series horizontal thinning machine is a transverse precision grinding equipment. The workpiece is absorbed by the vacuum spindle and the grinding wheel is used for high-speed grinding in the same direction. The precision leadscrew guide rail feeding system performs microfeed thinning processing. The grinding resistance is small, the workpiece will not be damaged, and the grinding is uniform and the production efficiency is high.
Products Show
Exportable High Precision Silicon Wafers Thinning and Lapping Machine
Usage: This unit is designed and produced for zirconia ceramics and sapphire LED substrate ect superhard product.
Notes: As the technology is constantly updated, the above data is for reference only.
Successful Cases
Features
1.CNC program control system, ensure the machine stability, security.
2.High speed shaft system with high precision, ensure the machining precision when high-speed, high strength grinding.
3.One touch type vacuum cup system, improve the convenience of the clamping.
4.Intelligent constant torque explosion-proof function.
5.Constant temperature cooling system.
6.Automatic compensation system.
7.Optional online thickness measurement device.
8.Optional automatic grinding wheel dresser.
Company Introduction
Dongguan KIZI Precision Grinding machinery Manufacturing Co., Ltd. Was established in 2010, mainly research and development, production, manufacturing, sales of high precision plane grinding machine, precision plane polishing machine and other CNC equipment and their matching consumables.
Our company offers variety of products which can meet your multifarious demands. We adhere to the management principles of "quality first, customer first and credit-based" since the establishment of the company and always do our best to satisfy potential needs of our customers. Our company is sincerely willing to cooperate with enterprises from all over the world in order to realize a win-win situation since the trend of economic globalization has developed with anirresistible force.
Our products are widely used in the grinding and polishing process of metal and non-metal (including ceramic, sapphire window sheet and substrate sheet, silicon carbide substrate, gallium nitride wafer, silicon wafer and other semiconductor materials), and the workpiece can obtain the best flatness of 1μ m and the roughness of 0.01μm.
Patents
Workshops and Labs
Our Service
1. Factory with competative price,high quality and stability
2. R&D Dep. with 20 technicians, 5 of them in decades experience
3. Free charge of customer sample making
4. Completed After sales service and expertise support from Taiwan
Packing & Delivery
Packing Details : Packing, 1 pcs/carton
Delivery Details : Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer.
Q: How long is your delivery time ?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
A:No, we could not offer the machine sample for free charge but can provide free proofing for the customer.
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